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Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan

TEL   |   +886-3-579-0022              FAX   |   +886-3-579-0011

Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan TEL   |   +886-3-579-0022 FAX   |   +886-3-579-0011
© 2024 Copyright Hermes-Epitek. All Rights Reserved.

Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, thick PI coating, and softbake.
The nozzle spreads photoresist on the wafer. The rotating platform then drives high-speed spinning of the wafer to enable uniform coating of photoresist on the wafer

Development: Post-exposure bake, development, and hardbake.
The nozzle spreads developer on the wafer. After photoresist is developed, the wafer is rinsed by deionized water (DIW) before being spun dry.

Can be used in conjunction with customer imprinting processes.

Product

LED Coater & Developer (4" & 6")

Hermes-Epitek

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the surface of sapphire substrate to define the PSS pattern, and conduct GaN, GaAs, AGIP etching during blue and red/yellow LED chip manufacturing.
Can be divided into physical, chemical, and reactive ion etching.

Product

LED Plasma Etch System

Hermes-Epitek

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Epitaxy

Metal organic compound elements under well controlled temperature and pressure, thin film are deposited uniformly on the substrate through chemical vapor deposition.

Product

  • MOCVD Systems (Up to 8”)
  • MG Series for GaAs/InP Application
  • MP Series for Power/RF Applications

Inspection

Product

Thin Film

In a high vacuum chamber, the e-beam evaporation equipment heats the material by e-beam irradiation until it is vaporized. The material is then deposited onto the surface of the wafer to form a thin film.

Product

Evaporator

Hermes-Epitek

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Encapsulation

Two-fluid gas-assisted atomization is used to uniformly coat the adhesive material.
The color conversion material can be mixed to achieve uniform color distribution.

Applications
Coating of phosphor, color conversion material (quantum dots), photoresist (thick photoresist, thin photoresist, and dyed photoresist), silicone, carbon nanopowder, and epoxy.
Applicable to high-aspect ratio structures.
Able to assist customers in process adjustment based on material characteristics.

Product

  • Spray Coater