IC Manufacturing Flow Diagram

Our manufacturing equipment

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IC Wafer

Crystal growth / Slicing
Planarization / Polishing
Mask Manufacturing
Diffusion & Thin Film
Wet Etch & Clean
Photo-Lithography
Dry Etch
Chemical-Mechanical Planarization
Wafer Testing
Process Metrology
and Monitoring

FI/FO WLP

Metal Film Deposition
Photo-Lithography
Electro-Plating
Wet Etch
Wafer Surface Cleaning
Wafer Bonder/De-bonder
Wafer Dicing
Wafer Bonding/Encapsulation
Ball Mount & Reflow
Process Metrology
and Monitoring

Assembly

Wafer Dicing
Wafer Bonding
Wire Bonding
Encapsulation
Inspection/ Testing

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Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan

TEL   |   +886-3-579-0022              FAX   |   +886-3-579-0011

Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan TEL   |   +886-3-579-0022 FAX   |   +886-3-579-0011
© 2024 Copyright Hermes-Epitek. All Rights Reserved.

Mask Manufacturing

Mask Manufacturing
The circuit diagram is traced onto a quartz/glass substrate via a laser/electron beam tracer. This substrate (photomask) is imaged onto the wafer or glass substrate by the stepper’s projection imaging technology.

Product

Semiconductor Laser Mask Writer

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage
IC Package Laser Mask Writer

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Photo Mask Repair
Laser CVD:
Using special laser CVD film forming technology to pyrolyze (photolyze) the carbonyl metal compound -Cr(CO)6. Cr is attached to the photomask to repair and connect bad circuits.

Product

Photo Mask Repair

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System

Diffusion & Thin Film/Ion implantation

Diffusion & Thin Film
用途廣泛，應用於擴散、趨入、氧化、薄膜沉積、退火、熱燒結
可分為常壓、低壓沉積、原子層薄膜沉積

Ion Implantation
Implanting ions into the wafers could increase semiconductor conductivity, forming either P-type or N-type semiconductor
It is mainly divided into high current, medium current, and high energy ion implanter

Product

High Current

Advanced Ion Beam Technology, Inc. (台灣)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)
Medium Current

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping
High Energy Implanter

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Wet Etch & Clean

Wet etch
Using the solvent to selectively remove a pattern on the surface of the wafer.
Can be divided into multi-reaction tank, single-tank, and single-wafer etching.

Clean 
In order to make a high precision silicon wafer product, a very clean surface is required for optimized quality.

Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, and softbake.
Exposure: Using the stepper in coordination with photomask.
Development: Post-exposure bake, development, and hardbake.

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the thin film on the surface of the wafer, and define a pattern.
Can be divided into physical, chemical, and reactive ion etching.

Chemical-Mechanical Planarization (CMP)

The protruding part of the surface of the wafer is removed by mechanical polishing, and partial polishing may also be selected.
Planarization slurry and chemical substances are added during polishing to increase polishing rate and flatness.

Wafer Testing

  • Conducting various wafer tests to determine the quality of design and manufacturing. It is regarded as the last line of defense before the wafer shipment.
  • The testing process can only be done by using the combination of the tester, prober, and probe card.

Product

Probe Card

漢民測試系統股份有限公司

Hermes Testing Solutions, Inc. (HTSI)

提供全方位半導體測試解決方案

(Cantilever, Vertical, MEMS, Membrane Probe Card)

Process Metrology and Monitoring

Process Metrology
Process parameters of each machine are measured, such as film thickness, critical dimension line width, multi-layer pattern alignment, etching depth, and surface roughness and surface 3d profile.  

Product

Desktop SEM (Scanning Electron Microscope)

Taiwan Electron Microscope Instrument Corporation (Taiwan)

Micro inspection system & Liquid-Phase Inspection Modules

  • Customized Scanning Electron Microscope.
  • SEI/BEI + STEM analysis.
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis.
  • Special design for 6″、8″ & 12″ objects non-destructive analysis.
High-Throughput AFM (Atomic Force Microscope)

為先進半導體製程發展，提供全進化的量測及檢測解決方案

全自動超高速 3D掃描探針顯微鏡，對於發展及監測以下先進製程特別有幫助：

  • CMP：Hybrid bonding，表面平整度及粗糙度
  • (High NA) 極紫光黃光製程：光阻量測及缺陷檢測
  • 高深寬比結構量測
  • 表面下對準及缺陷量測
In-Line Raman Spectrometer

E&R

In-Line Raman provides non-destructive metrology solutionfor Epi and thin film process

  • Epi/Thin film strain and stress
  • Epi/Thin film dopant concentration
  • Customizable for different structure and different size wafer

Airborne molecular contaminant monitoring
Detecting and monitoring possible sources of AMC in a clean room environment, including gas contaminants, process escape response, volatilization of equipment materials themselves, and volatilization during equipment maintenance processes.

Product

Whole Fab AMC Monitor/Control

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.
Portable AMC Monitor System

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Airborne Molecular Contamination (AMC)/Particle Filtration
Removal of AMC entering the plant or equipment by customized chemical filters.
Removal of powder particles entering the plant or equipment by customized, high-efficiency dust filters.

Product

MAU Chemical Filter

YESIANG Enterprise Co., Ltd.

  • AMC Chemical Filter 
  • HEPA / ULPA
FFU Chemical Filter

YESIANG Enterprise Co., Ltd.

  • AMC Chemical Filter 
  • HEPA / ULPA
Tool Chemical Filter

YESIANG Enterprise Co., Ltd.

  • AMC Chemical Filter 
  • HEPA / ULPA
HEPA / ULPA

YESIANG Enterprise Co., Ltd.

  • AMC Chemical Filter 
  • HEPA / ULPA

Metal Film Deposition

Metal film deposition on the surface of the wafer by magnetron sputtering

Product

PVD

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

Photo Lithography

The circuit pattern is copied to the photoresist material covering the surface of the wafer by optical projection imaging or laser direct imaging to achieve patterning.

Product

Stepper

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp
Laser Direct Imaging (LDI)

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp
Mask Aligner

Optical Associates Inc.

OAI is a Silicon Valley-based manufacturer of advanced precision equipment for the Solar, Photovoltaic, Semiconductor, MEMS, and Microfluidics Industries.

  • Mask Aligner
  • UV meter & Probes

Electro-Plating

Electroplating is an electrochemical deposition process that deposits a metal onto the surface of another metal object via an electrolytic reaction.

Product

ECD (Electrochemical Deposition) System

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

ECD System for WLCSP (Wafer Level Chip Scale Package)

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

ECD System for FOWLP (Fan-Out Wafer Level Package)

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

ECD System for PLP (Panel Level Package)

Wafer Bonder/De-bonder

Two wafers with different functions are aligned and bonded to complete the bonding between them. In terms of application, it can be divided into permanent bonding and temporary bonding.
The device wafer is temporarily bonded to a carrier wafer to facilitate the subsequent wafer thinning process; de-bonding is performed after the completion of post-production.

晶片黏合 (Wafer Bonding)

将已切好的晶片放置在IC基板上，相连之黏着，要求的是黏着的速度，正确度。

Product

Thermal Compression Gang Bonder & AXI+

Ball mount & reflow

Ball mount: Mounting the solder ball on the IC pad.
Reflow: The solder is melted through a heat treatment process to completely bond the solder balls to the pads.

Product

Ball Mount, Reflow and Inspection Integrated System

Fluxless Thermo-Compression Bonder & AXI+

Fluxless Solder Ball Bumping total solution

  • Symphony one (fluxless solder ball mount & reflow, Inspection & repair)
  • Symphony Fluxless Solder Ball Mount
  • Symphony Fluxless Reflow

Fluxless Thermal Compression Gang Bonder & AXI+

  • Concerto (fluxless thermal compression gang bonder)
  • AXI+ In-Tool Inspection & Repair (coming soon)

Process Metrology and Monitoring

Wafer surface defect inspection and measurement:
The wafer surface image is optically captured, and computer image processing technology is used to detect foreign object or pattern anomalies.

2D/3D X-ray testing：

CT：Computed tomography (CT) delivers three-dimensional images visualizing the inner structures of a scanned object, including the exact spatial position of defects or other regions of interest.

• Computerized tomography (CT) scanning: Computerized tomography (CT) scans provide 3D imaging of the internal structure of the scanned target, including defects or the precise spatial localization of other areas that need testing.

• Tomography: This is an intermediary tool between 2D X-ray scansand 3D CT scans. Its purpose is to solve the challenges in inspecting planar components; it provides reliable defect inspection as well asspatial localization in planar objects.

Product
Wafer inspection system

Tokyo Electron Device

RAYSENS is a macro inspection system that can detect defects on wafers with high speed and high sensitivity using optical technology that captures slight changes in light

 

Auto OM

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)
AI ADC

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)
2D AOI (Automated Optical Inspection)

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)
2D/3D X-ray Inspection

Comet-yxlon (Germany)

Comet yxlon designs, manufactures and markets high-end X-ray and CT system solutions with integrated services for industrial environments – from R&D labs to production settings.

Wafer Bonding

The cut dies (chips) are placed on the IC substrate to be bonded based on the required bonding speed and accuracy.

Product

Thermal Compression Gang Bonder & AXI+