Flat Panel Display (FPD) Manufacturing Flow Diagram

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Substrate
Mask Manufacturing

Ａrray

Thin Film
Photo-Lithography
Dry Etch
Laser Repair

CF

Color Filters

Cell / EVEN

Evaporation/Inkjet printing packaging (OLED)
Dicing/Assembly
Liquid Crystal Filling
Polarizer
Laser Repair

Module

IC Bonding
Backlight Modules
Laser Repair

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Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan

TEL   |   +886-3-579-0022              FAX   |   +886-3-579-0011

Address   |   No. 18, Creation Road 1, Hsinchu Science Park, Hsinchu 300093, Taiwan TEL   |   +886-3-579-0022 FAX   |   +886-3-579-0011
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Mask Manufacturing

Mask Manufacturing
The circuit diagram is traced onto a quartz/glass substrate via a laser/electron beam tracer. This substrate (photomask) is imaged onto the wafer or glass substrate by the stepper’s projection imaging technology.

Product

FPD Laser Mask Writer

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage
FPD Mask metrology system

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Photo Mask Repair
Laser CVD:
Using special laser CVD film forming technology to pyrolyze (photolyze) the carbonyl metal compound -Cr(CO)6. Cr is attached to the photomask to repair and connect bad circuits.

Product

FPD Photo Mask Repair

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System

Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, thick PI coating, and softbake.
The nozzle spreads photoresist on the wafer. The rotating platform then drives high-speed spinning of the wafer to enable uniform coating of photoresist on the wafer

Development: Post-exposure bake, development, and hardbake.
The nozzle spreads developer on the wafer. After photoresist is developed, the wafer is rinsed by deionized water (DIW) before being spun dry.

Can be used in conjunction with customer imprinting processes.

Product
LED Coater & Developer (4" & 6")

Hermes-Epitek

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the thin film on the surface of the glass substrate, and define a pattern.

Laser Repair

Black Matrix Masking
Using a special laser to melt the black matrix on the color filter, and then using it to cover the pixels with light leakage to achieve the masking effect.

Direct Method Masking
Using a special laser to carbonize the R/G/B color resist of the pixels with light leakage on the color filter to achieve the masking effect.

Laser CVD
Using special laser CVD film forming technology to pyrolyze (photolyze) the carbonyl metal compound -W(CO)6. W is attached to the panel to repair and connect any broken/bad circuits.

Product

FPD BM (Black Matrix) Light Leakage Repair

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System
FPD DM (Direct Method) Light Leakage Repair

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System
FPD Pad Pattern Repair

Cowin DST CO, LTD. (Korea)

  • FPD: Light Leakage Repair System; Pad Pattern Repair System; Half Tone Photo Mask Repair System
  • PV: Laser Selective Emitter Doping & Real Metal Contact
  • TSP: Laser Direct Patterning System; Cover Glass Hole Drilling & Edge Polishing System

Inkjet Printing

Spraying R/G/B organic light-emitting material and its corresponding conductive layer material on the glass substrate to form OLED pixel patterns.

LGP Manufacturing

The light guide plate (LGP) is a key component of backlight modules. The principle of complete reflection is used to transmit the light of the light source to the distal end of the LGP. Then, the diffusion point at the bottom of the LGP is used to diffuse at various angles, thereby improving the brightness of the panel and controlling brightness uniformity.

Product

High Replicaption Hot Embossing System

TC TECH Sweden AB (Sweden)

A patented unique system for the production of light guide plates

  • TCP 1000 HT/HP; 150 HPE; 100 HP
  • TCP EE, Edge Embossing