Hermes-Epitek’s flux-free multi-chip hot-press bonding machine is designed for high-performance, high-precision, and environmentally friendly processes. It enables simultaneous bonding of multiple dies, featuring exceptional high-precision alignment capabilities. With multiple high-resolution cameras, it is able to ensure accuracy of ±2μm or beyond. The equipment is capable of high-speed heating and cooling, which significantly shortens the process time and increases production capacity. It is suitable for advanced packaging applications such as CoWoS, HBM, and CSP.
