The all-in-one flux-free ball placement, reflow, inspection, and repair machine independently developed by Hermes-Epitek features a simplified ball placement process. It eliminates the need for flux and the corresponding stencils, as well as the equipment and chemicals required for flux cleaning. The machine provides customers with a cost-effective and eco-friendly solution suitable for advanced wafer packaging processes such as CoWoS, WLCSP, and Fan-Out.
Fluxless Solder Ball Mount, Inspection, Repair & Reflow
Fluxless Solder Ball Mount, Inspection, Repair & Reflow
Simplified work processes
Eliminate the use of flux and stencils, making processes simple and efficient.
Eliminate the need for cleaning equipment, resulting in no waste water discharge.
Novel SMB technology reduces stencil wear and maintenance needs.
Enhanced product performance
High-speed testing and dual-head repair.
Automatic feature calibration to adapt to diverse process requirements.
SYMPHOPNY One
The high-efficiency ball placement and reflow testing equipment, specially designed for the 12-inch wafer process, provides a flux-free, pollution-free and clean process. In addition, it is equipped with capabilities to recycle 100% of the solder, effectively reducing production costs.
SYMPHONY Reflow
The high-precision reflow equipment specially designed for C4, CuPillar and MicroPillar applications is able to for process requirements for 6-inch, 8-inch, and 12-inch wafers. It provides diverse temperature curves, uniform temperature control and real-time temperature monitoring functions, as well as low thermal budget process solutions.
