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High-current Ion Implanter

Free of energy contamination

High productivity

Precise beam angle control ability

Wide-range tilt implantation and cutting-edge ISO scan mode

Excellent particle defect control

Small footprint

AIBT specializes in high-current ion implant solutions, with systems applicable from the 28nm to 2nm process and beyond.

Our solutions deliver exceptional productivity and industry-leading energy contamination control performance. This is attributable to our patented Chicane Beamline technology. iBlazar’s precise ISO scan mode is able to achieve superior uniformity (U%) in high-tilt, low-energy implantation. Its wide tilt-angle range, precise control, and compensation capabilities make iBlazar an ideal fit for versatile applications.

iBlazar integrated with the latest ISO scan technology, meeting the needs of 2nm manufacturing process and beyond.

Ultra low energy high current ion implantation equipment

In the field of high current ion implantation, ultra low energy (ULE) is the ultimate challenge in terms of controlling manufacturing processes. Integrating domestic R&D and supply chains, AIBT has partnered with world-leading clients to overcome the technical challenges of cutting-edge logic processes.

iBlazar

Integrated with the latest ISO scan technology and a high-performance wafer transfer system, iBlazar adopts the industry standard, Liner Scan. iBlazar possesses the highest wafer tile angle implantation ability and is a market-leading technology that simultaneously offers outstanding particle defect control and high vacuum performance. iBlazar achieves exceptional performance in high current ion implantation machines thanks to its leading technology and high production benefits.

For more information, please visit the AIBT website : https://www.aibt.com.tw/

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